Mark Filion
July 26, 2018
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Collabora is heading East to sponsor and attend DebConf18, the annual Debian conference for developers! The week-long conference takes place for the first time in Asia, from July 29 to August 5 at the National Chiao Tung University Microelectronics and Information Research Center, in Hsinchu Taiwan.
In addition to Héctor Orón Martínez and Andrew Lee, who are members of the DebConf18 organizing committee, Collaborans Vivek Das Mohapatra, Helen Koike and Arnaud Rebillout will also be taking part and giving presentations at this year's conference. See below for details of their talks.
Last but not least, make sure to grab a copy of the August issue (#238) of Linux Format magazine & look for our column dedicated to the first DebConf to take place in Asia!
We look forward to seeing everyone in Hsinchu!
This talk is a report on the current status of the support of Secure Boot on Debian by the EFI team and what is missing. The team are going to explain the main architecture and workflow, the required changes in dak, how the signing service works and how this impacts packaging due to the new template binary packages required for the signing service.
Using a library without being exposed to any of its dependencies & without requiring recompilation of the binary that pulls it in. The goal is to improve portability of programs that are distributed with runtimes (cf flatpak) but which still need access to some libraries from the host (eg libGL) without requiring recompilation of either the host libraries or the application+runtime.
Over the last months, I’ve been trying to package an up-to-date version of Docker for Debian. I started this task with only a rough knowledge of Debian packaging. I discovered Go from zero, and especially the development practices in use by the Golang community. I got in touch with the Debian Go packaging team, and learned a lot more about Debian packaging tools, infrastructure, and practices. In this 20 minutes talk, I would like to provide some feedback on this experience, things I learnt and would like to share to an audience that might not be familiar with the issues faced by the Go packaging team.
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